116 layer decks, in turn, are notable as this is the first time Micron has been able to produce a single deck over 100 layers, a feat previously limited to Samsung. So we’re once again looking at a string stacked design, with Micron using a pair of 116 layer decks, up from 88 layers in the previous generation. And while that yield ramp is still ongoing, Micron’s Singapore fab is already capable of producing enough of the new NAND that Micron is comfortable in announcing it is shipping, albeit clearly in limited quantities.įrom a technical perspective, Micron’s 232L NAND further builds upon the basic design elements Micron honed in that generation. Micron first announced their 232L NAND back in May during their Investor Day event, revealing that the NAND would be available this year, and that the company intended to ramp up production by the end of the year. According to the company, the new NAND is already shipping to customers and in Crucial SSD products in limited volumes, with further volume ramping to take place later in the year. The sixth generation of Micron’s 3D NAND technology, 232L is slated to offer both improved bandwidth and larger die sizes – most notably, introducing Micron’s first 1Tbit TLC NAND dies, which at this point are the densest in the industry. Ahead of next week’s Flash Memory Summit, Micron this morning is announcing that their next-generation 232 layer NAND has begun shipping.
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